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ChemicalBook >> CAS DataBase List >> TANTALUM NITRIDE

TANTALUM NITRIDE

TANTALUM NITRIDE price.
  • $58.65 - $505.38
  • Product name: TANTALUM NITRIDE
  • CAS: 12033-62-4
  • MF: NTa
  • MW: 194.95
  • EINECS:234-788-4
  • MDL Number:MFCD00049568
  • Synonyms:Tantalum Nitride , powder (TaN);TANTALUM NITRIDE;tantalumnitride(tan) ;tantalum mononitride;TANTALUM NITRIDE, <5 MICRON, 99.5%;TANTALUM NITRIDE, 99.5% (METALS BASIS);Einecs 234-788-4;Tantalum nitride, 99.5% trace metals basis
3 prices
Selected condition:
Brand
  • Alfa Aesar
  • American Custom Chemicals Corporation
Package
  • 5MG
  • 10g
  • 50g
  • ManufacturerAlfa Aesar
  • Product number013093
  • Product descriptionTantalum nitride 99.5% (metals basis)
  • Packaging10g
  • Price$58.65
  • Updated2024-03-01
  • Buy
  • ManufacturerAlfa Aesar
  • Product number013093
  • Product descriptionTantalum nitride 99.5% (metals basis)
  • Packaging50g
  • Price$310
  • Updated2023-06-20
  • Buy
  • ManufacturerAmerican Custom Chemicals Corporation
  • Product numberING0005392
  • Product descriptionTANTALUM NITRIDE 95.00%
  • Packaging5MG
  • Price$505.38
  • Updated2021-12-16
  • Buy
Manufacturer Product number Product description Packaging Price Updated Buy
Alfa Aesar 013093 Tantalum nitride 99.5% (metals basis) 10g $58.65 2024-03-01 Buy
Alfa Aesar 013093 Tantalum nitride 99.5% (metals basis) 50g $310 2023-06-20 Buy
American Custom Chemicals Corporation ING0005392 TANTALUM NITRIDE 95.00% 5MG $505.38 2021-12-16 Buy

Properties

Melting point :3360°C
Density :14.6 g/cm3
solubility :insoluble in H2O; slightly soluble in aquaregia; reacts with alkaline solutions
form :Powder
color :black hexagonal, hexane crystals, crystalline
Resistivity :128–135 (ρ/μΩ.cm)
Water Solubility :Insoluble in water.
Crystal Structure :Hexagonal
CAS DataBase Reference :12033-62-4(CAS DataBase Reference)
EPA Substance Registry System :Tantalum nitride (TaN) (12033-62-4)

Safety Information

Symbol(GHS):
Signal word:
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Description

Tantalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.

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